EP2C5Q208I8ES 查看數據表（PDF） - Altera Corporation

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EP2C5Q208I8ES

Cyclone II Device Handbook, Volume 1

Altera Corporation 

Package Information for Cyclone II Devices

896-Pin FineLine BGA Package – Wirebond

■ All dimensions and tolerances conform to ASME Y14.5M - 1994.

■ Controlling dimension is in millimeters.

■ Pin A1’s location may be indicated by an ID dot in its proximity on

the package surface.

Tables 15–19 and 15–20 show the package information and package

outline figure references, respectively, for the 896-pin FineLine BGA.

Table 15–19. 896-Pin FineLine BGA Package Information

Description

Ordering code reference

Package acronym

Substrate material

Solder ball composition

JEDEC outline reference

Maximum lead coplanarity

Weight

Moisture sensitivity level

Specification

F

FineLine BGA

BT

Regular: 63Sn: 37Pb (typical)

Pb-free: Sn: 3.0Ag: 0.5Cu (typical)

MS-034 variation AAN-1

0.008 inches (0.20 mm)

11.5 g

Printed on moisture barrier bag

Table 15–20. 896-Pin FineLine BGA Package Outline Dimensions

Symbol

A

A1

A2

A3

D

E

b

e

Min.

–

0.30

–

–

0.50

Dimensions (mm)

Nom.

–

–

–

–

31.00 BSC

31.00 BSC

0.60

1.00 BSC

Max.

2.60

–

2.20

1.80

0.70

Altera Corporation

February 2007

15–19

Cyclone II Device Handbook, Volume 1

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