EP2C5Q208I8ES 查看數據表（PDF） - Altera Corporation

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EP2C5Q208I8ES

Cyclone II Device Handbook, Volume 1

Altera Corporation 

Package Information for Cyclone II Devices

672-Pin FineLine BGA Package, Option 3 – Wirebond

■ All dimensions and tolerances conform to ASME Y14.5M - 1994.

■ Controlling dimension is in millimeters.

■ Pin A1 may be indicated by an ID dot, or a special feature, in its

proximity on the package surface.

Tables 15–17 and 15–18 show the package information and package

outline figure references, respectively, for the 672-pin FineLine BGA

package.

Table 15–17. 672-Pin FineLine BGA Package Information

Description

Ordering code reference

Package acronym

Substrate material

Solder ball composition

JEDEC Outline Reference

Maximum lead coplanarity

Weight

Moisture sensitivity level

Specification

F

FineLine BGA

BT

Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

MS-034 Variation: AAL-1

0.008 inches (0.20 mm)

7.7 g

Printed on moisture barrier bag

Table 15–18. 672-Pin FineLine BGA Package Outline Dimensions

Symbol

A

A1

A2

A3

D

E

b

e

Min.

–

0.30

–

–

0.50

Dimensions (mm)

Nom.

–

–

–

–

27.00 BSC

27.00 BSC

0.60

1.00 BSC

Max.

2.60

–

2.20

1.80

0.70

Altera Corporation

February 2007

15–17

Cyclone II Device Handbook, Volume 1

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