EP2C5Q208I8ES 查看數據表（PDF） - Altera Corporation

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EP2C5Q208I8ES

Cyclone II Device Handbook, Volume 1

Altera Corporation 

Package Information for Cyclone II Devices

484-Pin Ultra FineLine BGA – Wirebond

■ All dimensions and tolerances conform to ASME Y14.5M – 1994.

■ Controlling dimension is in millimeters.

■ Pin A1 may be indicated by an ID dot, or a special feature, in its

proximity on package surface.

Tables 15–15 and 15–16 show the package information and package

outline figure references, respectively, for the 484-pin Ultra FineLine

BGA package.

Table 15–15. 484-Pin Ultra FineLine BGA Package Information

Description

Ordering Code Reference

Package Acronym

Substrate Material

Solder Ball Composition

JEDEC Outline Reference

Maximum Lead Coplanarity

Weight

Moisture Sensitivity Level

Specification

U

UBGA

BT

Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

MO-216 Variation: BAP-2

0.005 inches (0.12mm)

1.8 g

Printed on moisture barrier bag

Table 15–16. 484-Pin Ultra FineLine BGA Package Outline Dimensions

Symbol

A

A1

A2

A3

D

E

b

e

Min.

–

0.20

0.65

0.40

Millimeter

Nom.

–

–

–

0.80 TYP

19.00 BSC

19.00 BSC

0.50

0.80 BSC

Max.

2.20

–

–

0.60

Altera Corporation

February 2007

15–15

Cyclone II Device Handbook, Volume 1

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