STTH310 查看數據表（PDF） - STMicroelectronics
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STTH310 Datasheet PDF : 7 Pages
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STTH310
Characteristics
Figure 1. Conduction losses versus
average current
P(W)
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0
0.5
δ = 0.05
δ = 0.1 δ = 0.2
δ = 0.5
δ=1
T
IF(AV)(A)
δ=tp/T
tp
1.0
1.5
2.0
2.5
3.0
3.5
Figure 2. Forward voltage drop versus
forward current
IFM(A)
100.0
10.0
Tj=150°C
(typical values)
Tj=150°C
(maximum values)
Tj=25°C
(maximum values)
1.0
VFM(V)
0.1
0.0
0.5
1.0
1.5
2.0
2.5
Figure 3.
Relative variation of thermal
Figure 4.
impedance junction ambient
versus pulse duration (DO-201AD)
Relative variation of thermal
impedance junction ambient
versus pulse duration (SMC)
Zth(j-c)/Rth(j-c)
1.0
0.9
Epoxy printed circuit board, FR4,
Lleads = 10 mm
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
0.0
1.E-01
Single pulse
1.E+00
tp(s)
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
Zth(j-c)/Rth(j-c)
1.0
Epoxy printed circuit board, FR4,
0.9 S = 1cm2
0.8
0.7
0.6 δ = 0.5
0.5
0.4
δ = 0.2
0.3
δ = 0.1
0.2
0.1 Single pulse
0.0
1.E-01
1.E+00
tp(s)
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
Figure 5.
Thermal resistance junction to ambient versus copper surface under each lead
Rth(j-a)(°C/W)
110
100
90
80
70
60
50
40
30
20
10
0
0
1
Epoxy printed circuit board, FR4,
copper thickness = 35 µm
SMB
DO-201AD
Lleads=10mm
S(cm²)
2
3
4
5
Doc ID 9346 Rev 4
3/7
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