650VCoolMOS™C7PowerTransistor
IPB65R125C7
3Thermalcharacteristics
Table3Thermalcharacteristics
Parameter
Symbol
Thermal resistance, junction - case
RthJC
Thermal resistance, junction - ambient RthJA
Thermal resistance, junction - ambient
for SMD version
RthJA
Soldering temperature, wave- & reflow
soldering allowed
Tsold
Min.
-
-
-
Values
Typ. Max.
-
1.24
-
62
35 45
Unit Note/TestCondition
°C/W -
°C/W device on PCB, minimal footprint
Device on 40mm*40mm*1.5mm
epoxy PCB FR4 with 6cm² (one
°C/W
layer, 70µm thickness) copper
area for drain connection and
cooling. PCB is vertical without air
stream cooling.
-
-
260 °C reflow MSL1
Final Data Sheet
5
Rev.2.0,2013-10-11