LTC2607I-1 查看數據表（PDF） - Linear Technology

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LTC2607I-1

16-/14-/12-Bit Dual Rail-to-Rail DACs with I2C Interface

Linear Technology 

PACKAGE DESCRIPTIO

LTC2607/LTC2617/LTC2627

DE/UE Package

12-Lead Plastic DFN (4mm × 3mm)

(Reference LTC DWG # 05-08-1695)

0.65 ±0.05

3.50 ±0.05

1.70 ±0.05

2.20 ±0.05 (2 SIDES)

PACKAGE OUTLINE

0.25 ± 0.05

0.50

BSC

3.30 ±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

4.00 ±0.10

(2 SIDES)

R = 0.20

TYP

R = 0.115

7

TYP

0.38 ± 0.10

12

PIN 1

TOP MARK

(NOTE 6)

3.00 ±0.10 1.70 ± 0.10

(2 SIDES) (2 SIDES)

0.200 REF

0.75 ±0.05

0.00 – 0.05

6

1

0.25 ± 0.05

0.50

BSC

3.30 ±0.10

(2 SIDES)

BOTTOM VIEW—EXPOSED PAD

NOTE:

1. DRAWING PROPOSED TO BE A VARIATION OF VERSION

(WGED) IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

NOTCH

(UE12) DFN 0603

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

26071727f

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