ADSP-21061KSZ-160 查看數據表（PDF） - Analog Devices
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ADSP-21061KSZ-160 Datasheet PDF : 52 Pages
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ADSP-21061/ADSP-21061L
SURFACE-MOUNT DESIGN
Table 34 is provided as an aide to PCB design. For industry-standard design recommendations, refer to IPC-7351, Generic Requirements
for Surface-Mount Design and Land Pattern Standard.
Table 34. BGA Data for Use with Surface-Mount Design
Package
225-Ball Grid Array (PBGA)
Ball Attach Type
Solder Mask Defined
Solder Mask Opening
0.63 mm diameter
Ball Pad Size
0.73 mm diameter
ORDERING GUIDE
Model
ADSP-21061KS-133
ADSP-21061KSZ-133
ADSP-21061KS-160
ADSP-21061KSZ-160
ADSP-21061KS-200
ADSP-21061KSZ-200
ADSP-21061LKB-160
ADSP-21061LKBZ-160
ADSP-21061LKSZ-160
ADSP-21061LASZ-176
ADSP-21061LKSZ-176
1 Z = RoHS Compliant Part.
Notes
1
1
1
1
1
1
1
Temperature
Range
0C to 85C
0C to 85C
0C to 85C
0C to 85C
0C to 85C
0C to 85C
0C to 85C
0C to 85C
0C to 85C
–40C to +85C
0C to 85C
Instruction
Rate
33 MHz
33 MHz
40 MHz
40 MHz
50 MHz
50 MHz
40 MHz
40 MHz
40 MHz
44 MHz
44 MHz
On-Chip
SRAM
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
Operating
Voltage Package Description
5V
240-Lead MQFP_ED
5V
240-Lead MQFP_ED
5V
240-Lead MQFP_ED
5V
240-Lead MQFP_ED
5V
240-Lead MQFP_ED
5V
240-Lead MQFP_ED
3.3 V
225-Ball PBGA
3.3 V
225-Ball PBGA
3.3 V
240-Lead MQFP
3.3 V
240-Lead MQFP
3.3 V
240-Lead MQFP
Package
Option
SP-240-2
SP-240-2
SP-240-2
SP-240-2
SP-240-2
SP-240-2
B-225-2
B-225-2
S-240
S-240
S-240
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00170-0-5/13(D)
Rev. D | Page 52 of 52 | May 2013
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