
Package Outline
Unit: mm
CXA1498S
30PIN SDIP (PLASTIC) 400mil
+ 0.4
26.9 – 0.1
30
16
1
15
1.778
0° to 15°
CXA1498S/M
0.5 ± 0.1
0.9 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-30P-01
SDIP030-P-0400-A
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY / PHENOL RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE WEIGHT
1.8g
CXA1498M
30
30PIN SOP (PLASTIC) 375mil
+ 0.4
18.8 – 0.1
16
A
+ 0.4
2.3 – 0.05
0.10
0.1 ± 0.1
1
0.45 ± 0.1
15
1.27
+ 0.1
0.2 – 0.05
SONY CODE
EIAJ CODE
JEDEC CODE
± 0.12 M
SOP-30P-L03
∗SOP030-P-0375-C
0° to 10°
DETAIL A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
SOLDER PLATING
LEAD MATERIAL
PACKAGE WEIGHT
COPPER / 42 ALLOY
0.7g
– 13 –