
MITSUBISHI MICROCOMPUTERS
3822 Group
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
PACKAGE OUTLINE
80P6N-A
MMP
EIAJ Package Code
QFP80-P-1420-0.80
JEDEC Code
–
HD
D
80
65
1
64
Weight(g)
1.58
Lead Material
Alloy 42
24
25
41
40
A
L1
F
e
b
xM
y
L
Detail F
80P6S-A
MMP
EIAJ Package Code
QFP80-P-1414-0.65
JEDEC Code
HD
D
80
61
Weight(g)
1.11
1
60
Lead Material
Alloy 42
20
21
e
41
40
b
y
F
xM
A
L1
L
Detail F
Plastic 80pin 14✕20mm body QFP
MD
I2
Recommended Mount Pad
Symbol
A
A1
A2
b
c
D
E
e
HD
HE
L
L1
x
y
b2
I2
MD
ME
Dimension in Millimeters
Min Nom Max
–
–
3.05
0
0.1
0.2
–
2.8
–
0.3
0.35 0.45
0.13 0.15 0.2
13.8 14.0 14.2
19.8 20.0 20.2
–
0.8
–
16.5 16.8 17.1
22.5 22.8 23.1
0.4
0.6
0.8
–
1.4
–
–
–
0.2
–
–
0.1
0°
–
10°
–
0.5
–
1.3
–
–
–
14.6
–
–
20.6
–
Plastic 80pin 14✕14mm body QFP
MD
I2
Recommended Mount Pad
Symbol
A
A1
A2
b
c
D
E
e
HD
HE
L
L1
x
y
b2
I2
MD
ME
Dimension in Millimeters
Min Nom Max
–
–
3.05
0
0.1
0.2
–
2.8
–
0.25 0.3
0.4
0.13 0.15 0.2
13.8 14.0 14.2
13.8 14.0 14.2
–
0.65
–
16.5 16.8 17.1
16.5 16.8 17.1
0.4
0.6
0.8
–
1.4
–
–
–
0.13
–
–
0.1
0°
–
10°
–
0.35
–
1.3
–
–
–
14.6
–
–
14.6
–
74