HCS245MS 查看數據表（PDF） - Intersil

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HCS245MS

Radiation Hardened Octal Bus Transceiver, Three-State, Non-Inverting

Intersil 

HCS245MS

Die Characteristics

DIE DIMENSIONS:

124 x 110 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± -2.6kÅ

DIE ATTACH:

Material: Silver Epoxy

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCS245MS

DIR VCC

OE

NC

NC

(1)

(20) NC

NC

(19)

A0 (2)

A1 (3)

A2 (4)

A3 (5)

A4 (6)

(18) B0

(17) B1

(16) B2

(15) B3

(14) B4

A5 (7)

(8)

(9)

(10)

(11)

(12)

A6

A7

GND

B7

B6

7-481

(13) B5

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