Features
• Epitaxial Planar Die Construction
• Complementary NPN Type Available (ZXTN26020DMF)
• Low Collector-Emitter Saturation Voltage, VCE(SAT)
• High Current Gain (hFE) at High IC
• Surface Mount Package Suited for Automated Assembly
• Ultra-Small Surface Mount Package
• Qualified to AEC-Q101 Standards for High Reliability
• Lead, Halogen and Antimony Free, RoHS Compliant (Note 1)
• “Green” Device (Note 2)
• ESD rating: 400V-MM, 8KV-HBM

APPLICATIONs
• MOSFET and IGBT gate driving
• DC-DC conversion
• Interface between low voltage IC and Load
• Load disconnect switch