Features
• Ultra compact LLP1006-2L package
• Low package height < 0.4 mm
• 1-line ESD-protection
• Low leakage current < 0.1 µA
• Low load capacitance CD = 1.3 pF
• ESD-protection to IEC 61000-4-2
   ± 15 kV contact discharge
   ± 15 kV air discharge
• High surge current acc. IEC61000-4-5 IPP > 3 A
• Soldering can be checked by standard vision
   inspection. No X-ray necessary
• Lead (Pb)-free component
• Pin plating NiPdAu (e4) no whisker growth
• "Green" molding compound
• Component in accordance to RoHS 2002/95/EC
   and WEEE 2002/96/EC