FEATURES
PROPRIETARY SOFT GLASS® JUNCTION  PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
LOW SWITCHING NOISE
LOW THERMAL RESISTANCE
HIGH SWITCHING CAPABILITY
LOW FORWARD VOLTAGE DROP