Номер в каталоге
TCBAT43
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Tak Cheong Electronics (Holdings) Co.,Ltd
Specification Features:
◾ Low Forward Voltage Drop
◾ DO-35 Package (JEDEC)
◾ Through-Hole Device Type Mounting
◾ Hermetically Sealed Glass
◾ Compression Bonded Construction
◾ All External Surfaces Are Corrosion Resistant And Leads Are Readily Solderable
◾ RoHS Compliant
◾ Solder Hot Dip Tin (Sn) Lead Finish