
ON Semiconductor
Surface Mount Schottky Power Rectifier
SMB Power Surface Mount Package
. . . employing the Schottky Barrier principle in a metal−to−silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes.
FEATUREs
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guardring for Overvoltage Protection
• Low Forward Voltage Drop
• Pb−Free Package is Available
Mechanical Characteristics:
• Case: Molded Epoxy
• Epoxy Meets UL 94, V−O at 0.125 in
• Weight: 95 mg (approximately)
• Cathode Polarity Band
• Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
• Available in 12 mm Tape, 2500 Units per 13″ Reel, Add “T3” Suffix to Part Number
• Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
• ESD Ratings: Human Body Model = 3B
Machine Model = C
• Marking: SS26