FEATURES
♦ For surface mounted applications in order to optimize board space
♦ Low profile package
♦ Built-in strain relief
♦ Glass passivated junction
♦ Low inductance
♦ Excellent clamping capability
♦ Repetition Rate (duty cycle): 0.05%
♦ Fast reponse time: typically less than 1ps from 0 volts to VBR min.
♦ Typical ID less than 1µA above 10V
♦ High temperature soldering: 250°C/10 seconds at terminals
♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0