FEATURES
• For surface mounted applications
• Low profile package
• Ideal for automated placement
• Glass passivated
• High temperature soldering: 260 °C/10 s at
   terminals
• Wave and reflow solderable
• AEC-Q101 qualified
• Compliant to RoHS Directive 2002/95/EC and in
   accordance to WEEE 2002/96/EC
• Halogen-free according to IEC 61249-2-21 definition