Features
● Low profile package
● Ideal for automated placement
● Fast switching for high efficiency
● Glass passivated chip junctions
● High forward surge capability
● High temperature soldering：
   260℃/10 seconds at terminals
● Meets MSL level 1, per J-STD-020
● Component in accordance to
   RoHS 2011/65/EU and WEEE 2002/96/EC
● AEC−Q101 Qualified and PPAP Capable

Mechanical Date
● Case: JEDEC DO-214AA(SMB)
   Molding compound meets
   UL 94 V-0 flammability rating
● Terminals: Solder plated, solderable per
   MIL-STD-750， Method 2026
● Polarity:Laser band denotes cathode end