Features
• Batch process design, excellent power dissipation offers
   better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to
   optimize board space.
• High current capability.
• High surge current capability.
• Glass passivated chip junction.
• Superfast recovery time for switching mode application.
• Lead-free parts meet RoHS requirments.

Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, JEDEC DO-214AA/SMB
• Terminals : Solder plated, solderable per
   MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : 0.093 gram