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MMAD1108
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Microsemi Corporation
FEATURES
• 8 Diode Array
• SOIC 16 pin Surface Mount Package
• UL 94V-0 Flammability Classification
MECHANICAL
• Molded SOIC 16 Pin
• Weight: 0.128 grams (approximate)
• Marking: Logo, device number, date code
• Pin #1 defined by DOT on top of package
MAXIMUM RATINGS
• Operating Temperatures: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Forward Surge Current: 2.0 Amps (8.3 mS)
• Minimum Breakdown Voltage V(BR): 90V
• Working Peak Reverse Voltage VRWM: 75V
• Continuous forward current IF: 40 mA
• Power dissipation (PD): 500 mW
• Derating factor: 4.0 mW/°C