
TSC Corporation
Features
✧ For surface mounted application
✧ Plastic material used carriers Underwriters
Laboratory Classigication 94V-0
✧ Metal to silicon junction, majority carrier conduction
✧ Low power loss, high efficiency
✧ High current capability, low forward voltage drop
✧ High surge current capability
✧ For use in low voltage, high frequency inverters,
free wheeling, and polarity protection applications
✧ Guarding for overvoltage protection
✧ High temperature soldering guaranteed:
260℃ /10s at terminals
✧ Green compound with suffix "G" on packing
code & prefix "G" on datecode
Mechanical Data
✧ Case: JEDEC D2PAK Molded plastic
✧ Terminal: Pure tin plated, lead free, solderable
per MIL-STD-750, Method 2026
✧ Polarity: As marked
✧ Mounting position: Any
✧ Weight: 1.53 gram