Features
● Schottky Barrier Chip
● Guard Ring Die Construction for
   Transient Protection
● High Surge Current Capability
● Low Power Loss, High Efficiency
● Ideally Suited for Automatic Assembly
● For Use in Low Voltage, High Frequency
   Inverters, Free Wheeling, and Polarity
   Protection Applications

Mechanical Data
● Case: DPAK/TO-252, Molded Plastic
● Terminals: Plated Leads Solderable per
   MIL-STD-202, Method 208
● Polarity: See Diagram
● Weight: 0.3 grams (approx.)
● Mounting Position: Any
● Marking: Device Code, See Page 3
● Lead Free: For RoHS / Lead Free Version,
   Add “-LF” Suffix to Part Number, See Page 4