Description
The MA4P1250 and MA4P1450 are square surface mountable PIN diodes in a non-rollable, metal electrode leadless faced (MELF) package. They incorporate passivated PIN diode chips that are full face bonded to refractory metal pins. These parts utilize M/A-COM’s HIPAX technology in a low inductance ceramic package with no ribbons or whisker wires. The package is hermetically sealed at temperatures exceeding 300˚C.

FEATUREs
● Non-Rollable MELF Design
● Hermetically Sealed
● Low Loss, Low Distortion
● Passivated PIN Diode Chips
● Full Face Chip Bonds
● Non-Magnetic Package
● Pick and Place Compatibility