
STMicroelectronics
SUMMARY DESCRIPTION
The M36W0R6040T0 and M36W0R6040B0 are Multiple Memory Products which combine two memory devices; a 64-Mbit, Multiple Bank Flash memories, the M58WR064FT/B, and a 16-Mbit Pseudo SRAM, the M69AR024B. Recommended operating conditions do not allow more than one memory to be active at the same time. The memory is offered in a Stacked TFBGA88 (8x10mm, 8x10 ball array, 0.8mm pitch) package.
In addition to the standard version, the packages are also available in Lead-free version, in compliance with JEDEC Std J-STD-020B, the ST ECO PACK 7191395 Specification, and the RoHS (Restriction of Hazardous Substances) directive.
All packages are compliant with Lead-free soldering processes.
FEATURES SUMMARY
■ MULTI-CHIP PACKAGE
– 1 die of 64 Mbit (4Mb x 16) Flash Memory
– 1 die of 16 Mbit (1Mb x 16) Pseudo SRAM
■ SUPPLY VOLTAGE
– VDDF = VDDP = VDDQ = 1.7V to 1.95V
■ LOW POWER CONSUMPTION
■ ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Device Code (Top Flash Configuration), M36W0R6040T0: 8810h
– Device Code (Bottom Flash Configuration), M36W0R6040B0: 8811h
■ PACKAGES
– Compliant with Lead-Free Soldering Processes
– Lead-Free Versions
FLASH MEMORY
■ PROGRAMMING TIME
– 8µs by Word typical for Fast Factory Program
– Double/Quadruple Word Program option
– Enhanced Factory Program options
■ MEMORY BLOCKS
– Multiple Bank Memory Array: 4 Mbit Banks
– Parameter Blocks (Top location)
■ SYNCHRONOUS / ASYNCHRONOUS READ
– Synchronous Burst Read mode: 66MHz
– Asynchronous/ Synchronous Page Read mode
– Random Access: 70ns
■ DUAL OPERATIONS
– Program Erase in one Bank while Read in others
– No delay between Read and Write operations
■ BLOCK LOCKING
– All blocks locked at Power-up
– Any combination of blocks can be locked
– WPF for Block Lock-Down
■ SECURITY
– 128-bit user programmable OTP cells
– 64-bit unique device number
■ COMMON FLASH INTERFACE (CFI)
■ 100,000 PROGRAM/ERASE CYCLES per BLOCK
PSRAM
■ ACCESS TIME: 70ns
■ LOW STANDBY CURRENT: 110µA
■ DEEP POWER DOWN CURRENT: 10µA