Description
   The SOP-8 has been modfied through a customized eadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements. multiple devices can be used in an application with dramatically reduced board space. The package is desianed for vapor phase, inra red, orwave soldering technigues

FEATUREs
N-Ch:
● VDS (V)=30V
● RDS(ON) < 29mΩ (VGS = 10V)
● RDS(ON) < 46 mΩ (VGS = 4.5V)

P-Ch:
● VDS (V)=-30V
● RDS(ON)< 58mΩ (VGs = -10V)
● RDS(ON) < 98 mΩ (VGS = -4.5V)
● Generation V Technology
● Ultra Low On-Resistance
● Complimentary Half Bridge
● Surface Mount
● Fully Avalanche Rated
● Lead-Free