Номер в каталоге
DSI30-12AC
Компоненты Описание
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PDF
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производитель
IXYS CORPORATION
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DSI30-12AC Даташит - IXYS CORPORATION
IXYS CORPORATION
Features
• Silicon chip on Direct-Copper-Bond substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
• Low cathode to tab capacitance(15pF typical)
• International standard package
• Epoxy meets UL 94V-0
Номер в каталоге
Компоненты Описание
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