Features
• Silicon chip on Direct-Copper-Bond
   substrates
   - High power dissipation
   - Isolated mounting surface
   - 2500 V electrical isolation
• Low cathode to tab capacitance (< 25 pF)
• International standard package
• Planar passivated chips
• Very short recovery time
• Extremely low switching losses
• Low IRM-values
• Soft recovery behaviour
• Epoxy meets UL 94V-0
• Isolated and UL registered E153432

APPLICATIONs
• Antiparallel diode for high frequency
   switching devices
• Antisaturation diode
• Snubber diode
• Free wheeling diode in converters and
   motor control circuits and PFC circuits
• Rectifiers in switch mode power
   supplies (SMPS)
• Inductive heating
• Uninterruptible power supplies (UPS)
• Ultrasonic cleaners and welders

Advantages
• Avalanche voltage rated for reliable
   operation
• Soft reverse recovery for low EMI/RFI
• Low IRM reduces:
   - Power dissipation within the diode
   - Turn-on loss in the commutating switch