
Vishay Semiconductors
FEATURES
• High voltage up to 3000 V
• Outstanding stability < 0.5 %
• Flow solderable
• Custom sizes available
• Automatic placement capability
• Tape and reel packaging available
• Termination style: 3-sided wraparound termination or single termination flip chip standard; 5-sided wraparound termination available
• Internationally standardized sizes
• Suitable for solderable, epoxy bondable, or wire bondable applications
• Termination material: solder-coated nickel barrier or solder coated non-magnetic terminations standard; gold, palladium silver, platinum gold, platinum silver or platinum palladium gold terminations available
• Multiple styles, termination materials and configurations, allow wide design flexibility
• Epoxy bondable or wire bondable non-magnetic terminations available
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912