PROCESS DETAILS

   Process EPITAXIAL PLANAR
   Die Size 80 x 80 MILS
   Die Thickness 8.0 MILS
   Base Bonding Pad Area 18 x 27 MILS
   Emitter Bonding Pad Area 34 x 34 MILS
   Top Side Metalization Al - 30,000Å
   Back Side Metalization Ti/Pd/Ag - 20,000Å