Номер в каталоге
CP593
Компоненты Описание
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2 Pages
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414.4 kB
производитель
Central Semiconductor
CP593 Даташит - Central Semiconductor
Central Semiconductor
PROCESS DETAILS
Process EPITAXIAL PLANAR
Die Size 19 x 19 MILS
Die Thickness 9.0 MILS
Base Bonding Pad Area 3.5 x 4.3 MILS
Emitter Bonding Pad Area 3.5 x 4.5 MILS
Top Side Metalization Al - 30,000Å
Back Side Metalization Au - 18,000Å
Номер в каталоге
Компоненты Описание
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производитель
Small Signal Transistor PNP - Amp/Switch Transistor Chip ( Rev : 2006 )
Central Semiconductor
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