Номер в каталоге
CP517
Компоненты Описание
Other PDF
no available.
PDF
page
2 Pages
File Size
206.3 kB
производитель
Central Semiconductor
CP517 Даташит - Central Semiconductor
Central Semiconductor
PROCESS DETAILS
Process EPITAXIAL BASE
Die Size 111 X 111 MILS
Die Thickness 10 MILS
Base Bonding Pad Area 20 X 30 MILS
Emitter Bonding Pad Area 20 X 26 MILS
Top Side Metalization Al - 30,000Å
Back Side Metalization Au/Cr/Ni/Au - 6,000Å
Номер в каталоге
Компоненты Описание
View
производитель
Power Transistors PNP - Silicon Darlington Transistor Chip ( Rev : 2005 )
Central Semiconductor
Small Signal Transistor PNP - Darlington Transistor Chip ( Rev : 2002 )
Central Semiconductor
Share Link: 