
ComChip
Reverse Voltage: 20 to 150 Volts
Forward Current: 1.0 Amp
RoHS Device
FEATUREs
- Batch process design, excellent powe
dissipation offers better reverse leakage
current and thermal resistance.
- Low profile surface mounted application
in order to optimize board space.
- Tiny plastic SMD package.
- Low power loss, high efficiency.
- High current capability, low forward voltage dorp.
- High surge capability.
- Guardring for overvoltage protection.
- Ultra high-speed switching.
- Silicon epitaxial planarchip, metal silicon junction.
- Lead-free parts meet environmental
standards of MIL-STD-19500 /228
Mechanical data
- Case: Molded plastic, JEDEC Mini SMA/SOD-123.
- Terminals: Solde plated, solderable per
MIL-STD-750, method 2026.
- Polarity: Indicated by cathode band.
- Mounting position: Any
- Weight:0.027 gram(approx.).