BYV1100 Даташит - Philips Electronics
производитель

Philips Electronics
DESCRIPTION
Cavity free cylindrical glass package through Implotec(1) technology.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Available in ammo-pack.
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производитель
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CHENMKO CO., LTD.