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BYV1100 Даташит - Philips Electronics

BYV1100 image

Номер в каталоге
BYV1100

Компоненты Описание

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page
12 Pages

File Size
64.4 kB

производитель
Philips
Philips Electronics 

DESCRIPTION
Cavity free cylindrical glass package through Implotec(1) technology.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.


FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Available in ammo-pack.

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