Номер в каталоге
BYG23MF3
Компоненты Описание
Other PDF
no available.
PDF
page
4 Pages
File Size
369.7 kB
производитель

TSC Corporation
FEATURES
- Glass passivated junction chip.
- Ideal for automated placement
- Fast switching for high efficiency
- High surge current capability
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
- AEC-Q101 available
TYPICAL APPLICATION
The superior avalanche capability of BYG23M is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications.