BYD43-18 Даташит - Philips Electronics
производитель

Philips Electronics
DESCRIPTION
Cavity free cylindrical glass package through Implotec™ technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Available in ammo-pack.
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