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BYD37M Даташит - Philips Electronics

BYD37 image

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BYD37M

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page
12 Pages

File Size
67.2 kB

производитель
Philips
Philips Electronics 

DESCRIPTION
Cavity free cylindrical glass SOD81 package through Implotec™ technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.


FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Smallest surface mount rectifier outline
• Shipped in 8 mm embossed tape.

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