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BYD33K Даташит - Philips Electronics

BYD33 image

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BYD33K

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page
12 Pages

File Size
65.8 kB

производитель
Philips
Philips Electronics 

DESCRIPTION
Cavity free cylindrical glass package through Implotec™ technology. This package is hermetically sealedand fatigue free as coefficients of expansion of all used parts are matched.


FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack.

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