LEAD 1
INDICATOR
0.001 MIN.
.023 MAX.
.014 MIN.
1.89 MAX.
0.005 MIN.
.610 MAX.
.570 MIN.
0.155
MAX.
0.150
MIN.
0.100
.015 MAX.
.008 MIN.
.620 MAX.
.590 MIN.
Notes:
1. Package material: opaque ceramic.
2. All package finishes are per MIL-PRF-38535.
3. It is recommended that package ceramic be mounted on a heat removal
rail in the printed circuit board. A thermally conductive material should
be used.
(AT SEATING PLANE)
Figure 14. 36-Pin Side-Brazed DIP, Dual Cavity