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ZD5263BSH Просмотр технического описания (PDF) - Cystech Electonics Corp.

Номер в каталоге
Компоненты Описание
производитель
ZD5263BSH
CYSTEKEC
Cystech Electonics Corp. 
ZD5263BSH Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
CYStech Electronics Corp.
Spec. No. : C326SH
Issued Date : 2005.07.27
Revised Date :2017.09.25
Page No. : 6/7
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Sn-Pb eutectic Assembly
Pb-free Assembly
Average ramp-up rate
(Tsmax to Tp)
3°C/second max.
3°C/second max.
Preheat
Temperature Min(TS min)
100°C
150°C
Temperature Max(TS max)
Time(ts min to ts max)
150°C
60-120 seconds
200°C
60-180 seconds
Time maintained above:
Temperature (TL)
183°C
217°C
Time (tL)
60-150 seconds
60-150 seconds
Peak Temperature(TP)
240 +0/-5 °C
260 +0/-5 °C
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
6°C/second max.
6°C/second max.
Time 25 °C to peak temperature
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
ZD52XXBSH series
CYStek Product Specification

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