LTC7000/LTC7000-1
APPLICATIONS INFORMATION
PC Board Layout Considerations
1. Solder the exposed pad on the backside of the LTC7000/
LTC7000-1 packages directly to the ground plane of the
board.
2. Kelvin connect the SNS+ pin to the current sense
resistor.
3. Limit the resistance of the TS trace, by making it short
and wide.
4. CB needs to be close to chip.
5. Always include an option in the PC board layout to
place a resistor in series with the gate of any exter-
nal MOSFET. High frequency oscillations are design
dependent and having the option to add a series damp-
ening resistor can save a design iteration of the PC
board.
Pin Creepage and Clearance
In some higher voltage applications, the MSE16 package
may not provide sufficient PC board trace clearance
between high and low voltage pins. In applications where
clearance is required, the LTC7000-1 in the MSE16(12)
package can be used. The MSE16(12) package has
removed pins between all the adjacent high voltage
and low voltage pins, providing 0.657mm clearance,
which will be sufficient for most applications. For more
information, refer to the printed circuit board design
standards described in IPC-2221.
Rev. E
22
For more information www.analog.com