datasheetbank_Logo
Технический паспорт Поисковая и бесплатно техническое описание Скачать

LTC7000I Просмотр технического описания (PDF) - Analog Devices

Номер в каталоге
Компоненты Описание
производитель
LTC7000I Datasheet PDF : 30 Pages
First Prev 21 22 23 24 25 26 27 28 29 30
LTC7000/LTC7000-1
APPLICATIONS INFORMATION
PC Board Layout Considerations
1. Solder the exposed pad on the backside of the LTC7000/
LTC7000-1 packages directly to the ground plane of the
board.
2. Kelvin connect the SNS+ pin to the current sense
resistor.
3. Limit the resistance of the TS trace, by making it short
and wide.
4. CB needs to be close to chip.
5. Always include an option in the PC board layout to
place a resistor in series with the gate of any exter-
nal MOSFET. High frequency oscillations are design
dependent and having the option to add a series damp-
ening resistor can save a design iteration of the PC
board.
Pin Creepage and Clearance
In some higher voltage applications, the MSE16 package
may not provide sufficient PC board trace clearance
between high and low voltage pins. In applications where
clearance is required, the LTC7000-1 in the MSE16(12)
package can be used. The MSE16(12) package has
removed pins between all the adjacent high voltage
and low voltage pins, providing 0.657mm clearance,
which will be sufficient for most applications. For more
information, refer to the printed circuit board design
standards described in IPC-2221.
Rev. E
22
For more information www.analog.com

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]