ADSP-21160MKB-80 Просмотр технического описания (PDF) - Analog Devices

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ADSP-21160MKB-80

SHARC Digital Signal Processor

Analog Devices 

ENVIRONMENTAL CONDITIONS

Thermal Characteristics

The ADSP-21160x DSPs are provided in a 400-Ball PBGA (Plas-

tic Ball Grid Array) package.

The ADSP-21160x is specified for a case temperature (TCASE).

To ensure that the TCASE data sheet specification is not exceeded,

a heatsink and/or an air flow source may be used. Use the cen-

terblock of ground pins (for ADSP-21160M, PBGA balls:

H8-13, J8-13, K8-13, L8-13, M8-13, N8-13; for ADSP-21160N,

PBGA balls: F7-14, G7-14, H7-14, J7-14, K7-14, L7-14, M-14,

N7-14, P7-14, R7-15) to provide thermal pathways to the

printed circuit board’s ground plane. A heatsink should be

attached to the ground plane (as close as possible to the thermal

pathways) with a thermal adhesive.

TCASE = TAMB + PD  CA

• TCASE = Case temperature (measured on top surface

of package)

• TAMB = Ambient temperature °C

• PD = Power dissipation in W (this value depends upon the

specific application; a method for calculating PD is shown

under Power Dissipation).

• CA = Value from Table 39.

• JB = 6.46°C/W

Table 39. Airflow Over Package Versus CA

Airflow (Linear Ft./Min.)

CA (°C/W)1

1 JC = 3.6 °C/W

0

200

400

12.13 9.86 8.7

ADSP-21160M/ADSP-21160N

Rev. C | Page 51 of 60 | February 2013

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