PZTA96ST1(2002) Просмотр технического описания (PDF) - ON Semiconductor

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производитель

PZTA96ST1
(Rev.:2002)

High Voltage Transistor

ON Semiconductor 

PZTA96ST1

200°C

150°C

100°C

STEP 1

PREHEAT

ZONE 1

RAMP"

STEP 2

VENT

SOAK"

STEP 3

HEATING

ZONES 2 & 5

RAMP"

STEP 4

STEP 5

HEATING HEATING

ZONES 3 & 6 ZONES 4 & 7

SOAK"

SPIKE"

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

160°C

170°C

150°C

STEP 6 STEP 7

VENT COOLING

205° TO 219°C

PEAK AT

SOLDER JOINT

100°C

140°C

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

50°C

TIME (3 TO 7 MINUTES TOTAL)

TMAX

Figure 2. Typical Solder Heating Profile

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