Nexperia
13. Soldering
3.05
2.1
1.65 0.95
2.2
0.5
(2×)
0.6
(2×)
Fig. 5. Reflow soldering footprint for SOD323
5
2.9
1.5 (2×)
2.75
1.2
(2×)
Fig. 6. Wave soldering footprint for SOD323
PMEG2005AEA
Very low VF MEGA Schottky barrier rectifier
0.5 (2×) 0.6 (2×)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sod323_fr
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sod323_fw
PMEG2005AEA
Product data sheet
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14 June 2019
© Nexperia B.V. 2019. All rights reserved
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