NOT RECOMMENDED FOR NEW DESIGN
NO ALTERNATE PART
NIS5135
Absolute Maximum Ratings (Note 4) (@TA = +25°C, unless otherwise specified.)
Symbol
Characteristic
Value
Unit
Input Voltage in Steady State Operating Conditions (Note 5)
VDD
Input Voltage - Transient (100ms)
JA
Junction to Air Thermal Resistance
0.1 in2 (Note 6)
0.5 in2 (Note 6)
JL
Junction to Lead Thermal Resistance
-0.6 to +18
-0.6 to +25
227
95
27
V
C/W
JC
Junction to Case Thermal Resistance
20
PDMAX Package Power Dissipation at TA = +25C
1.3
W
—
Thermal Derating Above +25C
10.4
mW/°C
TS
Storage Temperature Range
-55 to +155
C
TJ
Operating Junction Temperature (Note 7)
-40 to +150
C
TL
Notes:
Lead Temperature During Soldering (10s)
+260
C
4. Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings
only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device
reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time.
5. Negative voltage will not damage the device provided that the power dissipation is within the package dissipation rating.
6. 1 oz copper on double sided FR-4 PCB.
7. Thermal limit is set above the maximum thermal rating. It is not recommended to operate the device at temperature above the maximum rating
for extended period.
Recommended Operating Conditions
Symbol
VDD
TJ
Characteristic
Supply Voltage
Operating Juntion Temperature Range
Test Condition
Operating
Operating
Rating
Unit
3.1 to 18.0
V
-40 to +150
C
NIS5135
Document number: DS37968 Rev. 4 - 3
5 of 13
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May 2017
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