ST7263BKX Просмотр технического описания (PDF) - STMicroelectronics

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ST7263BKX

Low speed USB 8-bit MCU family with up to 32 KB Flash/ROM, DFU capability, 8-bit ADC, WDG, timer, SCI and I²C

STMicroelectronics 

ST7263Bxx

Package characteristics

14.2

Thermal characteristics

Table 85. Thermal characteristics

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance (junction to

ambient)

SDIP32

SO34

SO24

LQFP48

QFN40

60

75

70

°C/W

80

34

PD

TJmax

Power dissipation(1)

Maximum junction temperature(2)

500

mW

150

°C

1. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation

of an application can be defined by the user with the formula: PD=PINT + PPORT where PINT is the chip

internal power (IDD x VDD) and PPORT the port power dissipation depending on the ports used in the

application.

2. The maximum chip-junction temperature is based on technology characteristics.

14.3

Soldering and glueability information

Recommended glue for SMD plastic packages dedicated to molding compound with

silicone:

● Heraeus: PD945, PD955

● Loctite: 3615, 3298

Doc ID 7516 Rev 8

171/186

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