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LPC8N04 Просмотр технического описания (PDF) - NXP Semiconductors.

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LPC8N04 Datasheet PDF : 39 Pages
First Prev 31 32 33 34 35 36 37 38 39
NXP Semiconductors
LPC8N04
32-bit ARM Cortex-M0+ microcontroller
12. Package outline
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
SOT616-3
D
BA
terminal 1
index area
A
A1
E
c
detail X
e1
C
1/2 e
e
b
v CAB
y1 C
y
7
12
wC
L
13
6
e
Eh
e2
1/2 e
1
18
terminal 1
index area
24
19
Dh
X
0
2.5
5 mm
Dimensions (mm are the original dimensions)
scale
Unit(1) A(1) A1 b
c D(1) Dh E(1) Eh e e1 e2 L
v
w
y y1
max 1 0.05 0.30
4.1 2.75 4.1 2.75
0.5
mm nom
0.2
0.5 2.5 2.5
0.1 0.05 0.05 0.1
min
0.00 0.18
3.9 2.45 3.9 2.45
0.3
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
European
projection
SOT616-3
MO-220
Fig 14. HVQFN24 package outline
sot616-3_po
Issue date
16-02-17
16-07-14
LPC8N04
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.3 — 15 March 2018
© NXP Semiconductors N.V. 2018. All rights reserved.
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