APA300-LGPP Просмотр технического описания (PDF) - Unspecified

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Компоненты Описание

производитель

APA300-LGPP

ProASIC PLUS® Flash Family FPGAs

Unspecified 

ProASICPLUS Flash Family FPGAs

Device Resources

User I/Os2

Commercial/Industrial

Military/MIL-STD-883B

Device

CCGA/

TQFP TQFP PQFP PBGA FBGA FBGA FBGA FBGA FBGA FBGA CQFP CQFP LGA

100-Pin 144-Pin 208-Pin 456-Pin 144-Pin 256-Pin 484-Pin 676-Pin 896-Pin 1152-Pin 208-Pin 352-Pin 624-Pin

APA075

66

107 158

100

APA150 66

158 242 100 186 3

APA300

158 4 290 4 100 4 186 3, 4

158 248

APA450

158 344 100 186 3 344 3

APA600

158 4 356 4

186 3, 4 370 3 454

158 248

440

APA750

158 356

454 562 5

APA1000

158 4 356 4

642 4, 5 712 5

158

248

440

Notes:

1. Package Definitions: TQFP = Thin Quad Flat Pack, PQFP = Plastic Quad Flat Pack, PBGA = Plastic Ball Grid Array, FBGA = Fine Pitch Ball Grid

Array, CQFP = Ceramic Quad Flat Pack, CCGA = Ceramic Column Grid Array, LGA = Land Grid Array

2. Each pair of PECL I/Os is counted as one user I/O.

3. FG256 and FG484 are footprint-compatible packages.

4. Military Temperature Plastic Package Offering

5. FG896 and FG1152 are footprint-compatible packages.

General Guideline

Maximum performance numbers in this datasheet are based on characterized data. Actel does not guarantee

performance beyond the limits specified within the datasheet.

v5.7

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