AD5204/AD5206
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter
VDD to GND
VSS to GND
VDD to VSS
VA, VB, VW to GND
IA, IB, IW
Pulsed1
Continuous
10 kΩ End-to-End Resistance
50 kΩ and 100 kΩ End-to-End
Resistance
Digital Input and Output Voltage
to GND
Operating Temperature Range
Maximum Junction Temperature
(TJ max)
Storage Temperature
Reflow Soldering
Peak Temperature
Time at Peak Temperature
Package Power Dissipation
Thermal Resistance, θJA2
PDIP (N-24-1)
SOIC (RW-24)
TSSOP (RU-24)
LFCSP (CP-32-3)
Rating
−0.3 V to +7 V
0 V to −7 V
7V
VSS, VDD
±20 mA
±11 mA
±2.5 mA
−0.3 V to (VDD + 0.3 V) or 7 V
(whichever is less)
−40°C to +85°C
150°C
−65°C to +150°C
260°C
20 sec to 40 sec
(TJ max − TA)/θJA
63°C/W
52°C/W
50°C/W
32.5°C/W
1 Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2 Thermal resistance (JEDEC 4-layer (2S2P) board). Paddle soldered to board.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. C | Page 6 of 20