MT46V16M16P-6H Просмотр технического описания (PDF) - Micron Technology

Номер в каталоге

Компоненты Описание

производитель

MT46V16M16P-6H

256Mb: x4, x8, x16 DDR SDRAM

Micron Technology 

256Mb: x4, x8, x16

DDR SDRAM

Figure 54: 60-Ball FBGA (16 x 9mm)

0.850 ±0.075

SEATING PLANE

0.10 C

C

60X Ø.45

SOLDER BALL DIAMETER REFERS TO

POST REFLOW CONDITION. THE

PRE-REFLOW DIAMETER IS Ø 0.40mm.

BALL A9

6.40

0.80

TYP

BALL A1 ID

BALL A1

8.00 ±0.05

SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or

62% Sn, 36% Pb, 2% Ag

SOLDER BALL PAD: Ø .33mm

SUBSTRATE: PLASTIC LAMINATE

MOLD COMPOUND: EPOXY NOVOLAC

BALL #1 ID

11.00

5.50 ±0.05

CL

1.00

TYP

16.00 ±0.10

CL

3.20 ±0.05 4.50 ±0.05

9.00 ±0.10

NOTE:

All dimensions are in millimeters.

1.20 MAX

09005aef8076894f

256MBDDRx4x8x16_2.fm - Rev. F 6/03 EN

79

Micron Technology, Inc., reserves the right to change products or specifications without notice.

©2003 Micron Technology, Inc.

Share Link: