S34ML01G2 Просмотр технического описания (PDF) - Spansion Inc.

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S34ML01G2

Spansion® SLC NAND Flash Memory for Embedded

Spansion Inc. 

Data Sheet

10. Ordering Information

The ordering part number is formed by a valid combination of the following:

S34ML 04G 2 00 T

F

I 00 0

Packing Type

0 = Tray

3 = 13” Tape and Reel

Model Number

00 = Standard Interface / ONFI (x8)

00 = Standard Interface (x16)

01 = ONFI (x16)

Temperature Range

I = Industrial (-40°C to + 85°C)

A = -40°C to + 85°C, GT-grade

V = Automotive (-40°C to + 105°C)

B = -40°C to + 105°C, GT-grade

Materials Set

F = Lead (Pb)-free

H = Lead (Pb)-free and Low Halogen

Package

B = 63-Ball BGA

G = 67-Ball BGA

T = TSOP

Bus Width

00 = x8 NAND, single die

04 = x16 NAND, single die

Technology

2 = Spansion NAND Revision 2 (32 nm)

Density

01G =

02G =

04G =

1 Gb

2 Gb

4 Gb

Device Family

S34ML

Spansion SLC NAND Flash Memory for Embedded

Valid Combinations

Valid Combinations list configurations planned to be supported in volume for this device. Consult your local

sales office to confirm availability of specific valid combinations and to check on newly released

combinations.

Device

Family

S34ML

Density

01G

02G, 04G

Valid Combinations

Technology

Bus

Width

Package

Type

Temperature

Range

Additional Ordering

Options

Packing

Type

BH, GH, TF

I, A

00, 01

Unique ID support

guaranteed:

2

00, 04

BH, TF

I

90 — Standard

0, 3

Interface / ONFI1.0 (x8)

91 — ONFI1.0 (x16)

Package

Description

TSOP, BGA (1)

Note:

1. BGA package marking omits the leading “S34” and the Packing Type designator from the ordering part number.

74

Spansion® SLC NAND Flash Memory for Embedded

S34ML01G2_04G2_10 September 5, 2014

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